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Optimization of Arrangement of LED on the PCB for High Power LED Module
Ju Yong Cho1, Ho Seob Kim2, Won Kweon Jang3
1Ju Yong Cho, Ph.D Candidate, Optoelectronics, Hanseo university, Seosan, South Korea.
2Ho Seob Kim, Professor, Department of Nanoscience, Sunmoon University, Asan, South Korea.
3Won Kweon Jang, Professor, Department of Aeronautic Electricity, Hanseo University, South Korea.
Manuscript received on November 25, 2019. | Revised Manuscript received on December 08, 2019. | Manuscript published on December 30, 2019. | PP: 384-387 | Volume-9 Issue-2, December, 2019. | Retrieval Number: B3187129219/2019©BEIESP | DOI: 10.35940/ijeat.B3187.129219
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)

Abstract: LED operating under high-temperature condition badly affects reliability. To reduce junction temperature of LED is crucial. In this paper, luminous intensity and photo conversion efficient with respect to electrical power are discussed. Moreover, three arrangements for LED module are suggested, and design parameters are discussed in terms of the number of LEDs and distance between each LED. In order to evaluate thermal performance of designed the module, computer simulation was conducted. Distance between each LED is selected by 7.6, 9.6, and 13.3mm for 80, 128, and 240 LEDs, respectively and unit heat flux is calculated to be 0.47W/mm2 , 0.29W/mm2 , 0.16W/mm2 for 80, 128, and 240 LEDs, respectively. In this case, Maximum temperature on the PCB was 67.8C, 62.5C, and 57.1C for 80, 128, and 240 LEDs, respectively. The Maximum temperature and unit heat flux was reduced by 15.7% and 66%, respectively, when the number of LEDs are increased by three times. We found that the temperature between LEDs can be reduced if unit heat flux can be reduced.
 Keywords: Thermal resistance, Thermal degradation, High power LEDs, Heat transfer, Heat flux.

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