CNT – A Solution for Interconnects
Sandeep Dhariwal1, Vijay K. Lamba2, Ritu Vijay3
1Sandeep Dhariwal, Assistant Professor, Electronics & Communication, H.C.T.M. Technical Campus-Kaithal, India.
2Dr. Vijay K. Lamba, Principal, Global colleges of Engineering & Techanology, Kahnpur Khui (Ropar), India.
3Dr. Ritu Vijay, Associate Professor, Deptt. of Electronics, Banasthali University – Banasthali, Rajasthan, India.
Manuscript received on august 12, 2012. | Revised Manuscript received on September 01, 2012. | Manuscript published on October 30, 2012. | PP: 255-262 | Volume-2 Issue-1, October 2012. | Retrieval Number: A0692092112 /2012©BEIESP
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: In this paper we have studied the properties of CNT as interconnects and calculated the parameters to analyse our results through table and plots. Due to their excellent electrical properties and small size, metallic carbon nanotubes (CNTs) are promising materials for interconnect wires in future integrated circuits. Simulations have firmly established CNTs as strong contenders for replacing or complementing copper interconnects. As copper wires are scaled down to narrow dimensions to keep up with the miniaturization of the transistors according to Moore’s Law, they suffer from adverse narrow-width effects degrading the chip performance. In the long term, the introduction of another interconnects material as a replacement for copper might be the solution. In this review paper, CNTs offer great promises as alternative interconnect materials.
Keywords: CNT, SWCNT, MWCNT, RLC Model.